Almost Brand New K&S IConn Plus Automatic Wire Bonder

Description

Almost Brand New K&S IConn Plus Automatic Wire Bonder
You are biting  one set almost brand new K&S IConn Plus Automatic Wire Bonder
. This machine was manufactured in April, 2018 and was installed in one of our partner
’
s R&D lab.  Since last 2 years pandemic, the lab was closed and these brand new equipment need to be relocation.  This set
K&S IConn Plus Automatic Wire Bonder
original buy in price is US3,500.00.  and we are looking for sell at only US,000.00.
Description
IConnPS PLUSTM is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need — for Wire Bonding today, PLUS tomorrow. To meet all leading edge wire bonding challenges, the IConn PLUS was designed with new capabilities and features in five key focus areas:
▪ Process Robustness
▪ Production Portability
▪ Ease of Use
▪ Robust Hardware Performance
▪ Upgradeability
Features
▪ Upgraded Control System that provides the latest available technology.
▪ +/- 2.0 μm accuracy.
▪ High Performance X-Y-Z motion control system.
▪ Dual-frequency transducer allows two selectable frequencies for each bond.
▪ Power Series Advanced Loop for tight control of the last kink height.
▪ On-board process optimization tools.
▪ 1pF Auto-BITS self-teach and optimization.
▪ WAVI (Wide Angle Vertical Illumination) system with programmable red and blue lighting.
▪ Optional programmable focus with a full 2.5 mm focus range.
▪ Optional copper wire bonding kit.
▪ Optional Large Area (LA) upgrade kit
WIRE BONDING CAPABILITY
Ultra Fine Pitch for Au Wire 35 μm inline @ 3 sigma Bonding Area X Axis: 56 mm Y Axis: 80 mm Total Bond Placement Accuracy 2.0 μm @ 3 sigma Pattern Recognition/Optics/Vision Progressive Scan Vision Engine CCD Video Camera
▪ Dual Magnification Optics (2x & 6x)
▪ Optional Programmable Focus for High Magnification Standard User Processes Compatible with all Legacy Processes Power Series Advanced Loop Power Series Low Loop
Compatibility Power Series bond programs are upwardly compatible with the IConn PLUS models - optimization on the newer bonder is recommended for full performance.
Process Programs are NOT backward compatible.
Programs taught on a new bonder model will not run on an older model.
LOOPING CAPABILITY
Maximum Wire Length 7.6 mm with 1.0 mil wire 3.0 mm with 0.6 mil wire
Minimum Loop Height Ultra-low loop with Power Series Low Loop 40 μm with 0.6 mil wire
Wire Sway Wire length < 2.54 mm: 25 μm @ 3 sigma Wire length > 2.54 mm: ± 1 % wire length @ 3 sigma
SET UP & CONVERSION TIMES
Same Leadframe Type: < 4 min (Heat block insert & clamp changes, program load from disk) Different Leadframe Type: < 8 min (Leadframe width & length changes, magazine size change, heat block insert & clamp change, program load from disk)
KNET PLUS ASSEMBLY EQUIPMENT NETWORK KNet PLUS
- improves efficiency and productivity, by monitoring equipment status in real-time. It collects data and controls process programs locally or from anywhere on a customer’s network. Contact your K&S Sales Representative to learn more.
MATERIAL HANDLING CAPABILITY
Package/Leadframe
Dimensions Length: 90 to 300 mm (L/F shorter than 100 mm will require optional injector kit)
Width: 15 to 92 mm
Thickness: 0.10 to 0.9 mm (L/F thicker than 0.9mm will require optional Flat Boat Kit)
Die Pad Downset: Up to 2.3 mm
Magazine Dimensions Width: 20 to 98 mm Length: 127 to 305 mm Height: 50 to 178 mm
Slot Pitch: 1.27 to 25 mm Max.
Weight: 5.22 kg
If you want more other used equipments, please access following link:
http://www.equipcaog.com/Hot%20Sell%20List%202012-8-28.pdf
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